an official journal of: published by:
Editor in Chief: RAFFAELLO COSSU


  • Lidiane Maria Andrade - Department of Chemical Engineering of the Polytechnic School, University of São Paulo , Brazil
  • Mariana Alves de Carvalho - Department of Chemical Engineering of the Polytechnic School, University of São Paulo, Brazil
  • Marcos Paulo Kohler Caldas - Federal Institute of Education, Science and Technology of Espirito Santo, Brazil
  • Denise Espinosa - Department of Chemical Engineering of the Polytechnic School, University of Sao Paulo, Brazil
  • Jorge Tenòrio - Department of Chemical Engineering of the Polytechnic School, University of São Paulo, Brazil

DOI 10.31025/2611-4135/2021.14056

Released under CC BY-NC-ND

Copyright: © 2019 CISA Publisher

Editorial History

  • Received: 06 May 2019
  • Revised: 20 Oct 2020
  • Accepted: 18 Nov 2020
  • Available online: 26 Feb 2021


Over the years, the generation of Waste Electric and Electronic Equipment has been significantly increased, which leads to environmental and economic concerns. Thus, it is fundamental to develop treatment methods for these residues. Printed Circuit Boards are essential components of electronic equipments. In this sense, printed circuit boards are composed of remarkable metals, in particular, copper and silver at high and low concentrations, respectively. These metals can be recovered by the hydrometallurgical process followed by a chemical purification step. Therefore, the aim of this study was to leach silver and copper from two different printed circuit boards (memory board and motherboard) from obsolete computers by hydrometallurgical route based on only one-stage leaching in oxidant media. When compared to the motherboard, a higher recovery rate of Ag was obtained from memory boards 83% and 33%, respectively. Whereas, similar recovery rates of copper were observed for memory board and motherboard, 48% and 46%, respectively.



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